Crosstalk Reduction by Voltage Scaling in Global VLSI Interconnects

نویسندگان

  • B. K. KAUSHIK
  • S. SARKAR
  • R. P. AGARWAL
چکیده

Voltage scaling has been often used for reducing power dissipation of CMOS driven interconnects. An undesired effect observed due to voltage scaling is increase in propagation delay. Thus a trade off lies between power dissipation and propagation delay with voltage scaling. However, voltage scaling can result in overall reduction of power delay product (PDP). Therefore, their lies an optimized supply voltage where-in power dissipation and propagation delay can be optimized. Many of the previous researchers have discussed about power dissipation and propagation delay only with voltage scaling. This paper for first time shows the effect on crosstalk in voltage scaled interconnects. It is quite encouraging to observe that irrespective of technology node used, an optimized voltage scaling reduces normalized crosstalk level. This paper shows simulation results for crosstalk reduction in different nano-sized CMOS driven RLC-modeled interconnects.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

CROSSTALK NOISE REDUCTION USING WIRE SPACING IN VLSI RC GLOBAL INTERCONNECTS Anushree

ABSTRCAT This paper presents a closed form 2π crosstalk noise model for on-chip VLSI RC interconnects. It considers a case when unit step input is applied to the aggressor which is adjacent to the victim net and producing crosstalk noise effect over it. In the next section closed form formulae for crosstalk noise pulse width and noise amplitude for RC interconnect have been derived for mathemat...

متن کامل

Crosstalk Noise Reduction Using Driver Sizing Optimization in Vlsi Rc Global Interconnects Using 90nm Process Technology

In this paper noise avoidance in closed form crosstalk noise model for on-chip VLSI RC interconnects using 2π model is presented. In this crosstalk noise model we consider the case when step input is applied to the aggressor which is adjacent to the victim net and further simplified it, then find out the closed form formulae for noise pulse width and noise amplitude for RC interconnect. Various...

متن کامل

Comprehensive Evaluation of Crosstalk and Delay Profiles in VLSI Interconnect Structures with Partially Coupled Lines

In this paper, we present a methodology to explore and evaluate the crosstalk noise and the profile of its variations, and the delay of interconnects through investigation of two groups of interconnect structures in nano scale VLSI circuits. The interconnect structures in the first group are considered to be partially coupled identical lines. In this case, by choosing proper values for differen...

متن کامل

Analytical Modeling of Crosstalk Noise and Delay for High Speed On-chip Global Rlc Vlsi Interconnects

With the advancement of high frequency in the VLSI technology, the modeling of the interconnections is much important as the performance of the electronics systems is limited by interconnect related failure modes such as coupled noise and delay. Exact estimation of on-chip signal delay through RC tree network is difficult. Inductance causes noise in the signal waveforms, which can adversely aff...

متن کامل

Effect of Distributed Shield Insertion on Crosstalk in Inductively Coupled VLSI Interconnects

Crosstalk in VLSI interconnects is a major constrain in DSM and UDSM technology. Among various strategies followed for its minimization, shield insertion between Aggressor and Victim is one of the prominent options. This paper analyzes the extent of crosstalk in inductively coupled interconnects and minimizes the same through distributed shield insertion. Comparison is drawn between signal volt...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2007